- Company Profile
- Vision & Philosophy
- Management Team
- Quality Policy
- Milestones
- Company Map
- Contact Us

The management team of Fintek is familiar with R&D, marketing, application services, and sales of ICs related to computer systems. Since its establishment in 2002, the company has developed various integrated circuit chips applied to industrial computers, personal computers, computer peripherals, and information appliances. Fintek focuses on developing industrial computers as the main body, analog-digital mixed-signal IC design technology, and laying out products related to industrial IoT. The company strengthens high-speed interfaces, analog function circuits, and integrated R&D technology of microprocessors, aiming to develop practical and environmentally friendly products that meet the demands of tomorrow's world.
Manufacturing
All product manufacturing is entrusted to professional foundries and packaging and testing companies. Fintek is a fabless IC design company. To meet customers' product specification needs, we consider suppliers' process technology, yield, price, quality control during the production process, and delivery control, paired with self-designed test software to ensure product quality.
Marketing
Fintek is committed to providing customers with comprehensive product solutions. We engage in early-stage cooperation discussions with target customers during product development to fully grasp market dynamics and trends. We aim to launch innovative specifications at lower costs or quickly develop new generation products when system and interface specifications are adjusted. Sales are expanded through professional distributors, and we provide efficient after-sales service and technical consulting.
Human Resources
Talent is the company's greatest asset. To implement the idea of respecting and caring for talent, Fintek's management team adheres to the philosophy that "the company is not just a company, but a second home for employees; work is not just work, but a process to achieve dreams." We aim to create an equal, respectful, happy, and growing work environment that ensures a win-win situation for both employees and the company.
Service
Think from the customer's perspective and provide the most competitive products and services through teamwork.
Innovation
Strive for continuous self-improvement and deepen core competitive advantages.
Respect
People-oriented, providing a learning and challenging environment to unleash employees' potential.
Sharing
Build open and trustworthy employee relationships based on integrity and share business achievements.
Product Development
Focusing on analog-digital mixed-signal IC design technology, we are committed to providing customers with competitive, high-quality products and application technology services. From the early stages of our business, we have collaborated with manufacturers to establish a cooperative development model, sharing technology, complementing resources, and exchanging creative and market information. Internally, we establish reusable software and hardware intellectual property, apply for circuit design and conceptual application patents, and shorten the development timeline of derivative products.



Environmental Monitoring Chips

Transceiver Chips

Charging Power Management Chips

Vision
To become a leading global professional design company for mixed-signal ICs and embedded ICs.
Mission
To become the most trusted partner for our customers through exceptional system applications, technological integration, and innovative functionality.


Business Philosophy
Service: Think from the customer's perspective and provide the most competitive products and services through teamwork.
Innovation: Strive for continuous self-improvement and deepen core competitive advantages.
Respect: People-oriented, providing a learning and challenging environment to unleash employees' potential.
Sharing: Build open and trustworthy employee relationships based on integrity and share business achievements.
Chief Strategy Officer | Shen-Bao Chen | Master of Business Administration, Royal Roads University, Canada Bachelor of Science in Electronics, Chung Yuan Christian University Assistant Vice President of Product Center, Winbond Electronics Corp |
President | Te-Hsun Huang | Master of Electrical Engineering, National Tsing Hua University Section Manager of R&D Department, Winbond Electronics Corp. |
Senior Vice President | Tseng-Wen Chen | Bachelor of Electrical Engineering, National Yunlin University of Science and Technology Deputy Department Manager of Marketing & Planning Department, Winbond Electronics Corp. |
Sales Div. Director | Sheng-Feng Huang | Master of Electronic Engineering Technology, National Taiwan University of Science and Technology Department Manager of Sales Department, Winbond Electronics Corp. |
RD Div. Director | Yu-Lin Lan | Bachelor of Electrical Engineering, National Sun Yat-sen University Engineer, Winbond Electronics Corp. |
System Application Div. Director | Gung-An Lin | Bachelor of Electrical Engineering, National Cheng Kung University Process integration Engineer, United Microelectronics Corp. |
Accounting Dept. Department Manager | Ying-Shiou Chen | Bachelor of Accounting,National Cheng Kung University Audit Manager , Deloitte Taiwan |
Finance Dept. Department Manager | Shin-Hua Chou | Bachelor of Finance, Chung Hua University Financial Administrator, Radiant Innovation Inc. |
2024
- Launched I2C/I3C to GPIO (F75116)
2024
2023
- Launched SPI to UART bridge for ARM platforms (F81561)
- Launched RS485 transceiver with automatic detection function (F81486)
2022
- Feature Integration Technology Inc. (Stock Code: 4951) listed on the Taipei Exchange on November 3, 2022.
- Launched integrated eSPI/LPC interface I/O controller and transceiver IC (F82660)
- Launched transceiver with automatic detection function for ARM platforms (F81433)
2022
2021
- Purchased an office building of the ninth phase of Tai Yuen Hi-Tech Industrial Park
- Launched dual-port Type C PD3.0 fast-charging protocol product suitable for industrial computers (F75183D)
- Launched CANBus FD bridge with USB/eSPI interface for Industry 4.0 (F81504A)
2020
- Launched USB 2.0 to 8051 bridge (F75506)
- Launched 3-in-1 RS232/422/485 transceiver with automatic detection function (F81435)
2020
2019
- Launched CANBus bridge with PCIE/USB/eSPI interface for industrial computers (F81601)
- Launched uC based Super I/O (F81968)
- Launched uC Based EDID Chip (F86700)
2018
- Launched I2C switch bridge (F85002)
- Launched eSPI/LPC interface 8051 I/O IC (F85228)
2018
2017
- Launched USB 2.0 to 4/8/12 UART bridge (F81532/F81534)
- Certified for ISO9001:2015 quality management system
- Launched Type C MUX product
2016
- Launched the second eSPI/LPC interface I/O IC with fast-charging products compatible with more protocols such as QC4.0, PD3.0, BC1.2, PE3.0, and AFC (F75292)
- Launched eSPI to LPC bridge (F85227N)
- Launched Type C PD fast-charging product for industrial computers (F75183I)
2016
2015
- Launched eSPI/LPC interface I/O IC (F81966)
- Launched QC3.0 and Apple/BC1.2 compatible fast charging products
- Launched first type C PD fast charging product (F75192)
- Launched CC Logic fast charging product
2014
- Wholly-owned subsidiary "Vision Advance Technology Inc." established
- Launched the industry's first QC2.0 and Apple/BC1.2 compatible fast charging products collaborated with Qualcomm Semiconductor Corporation
- Launched the industry's first QC2.0 with transmission function and Apple/BC1.2 compatible fast charging products collaborated with Qualcomm Semiconductor Corporation
2014
2013
- Launched CAN Bus transceiver (F81251)
- Launched PCIE 3.0 Switch bridge (F81042A)
2012
- Launched USB 2.0 to 2/4 UART bridge (F81534)
- Launched USB + MCU bridge for gaming (F75504)
- Launched three-in-one RS232/422/485 transceiver (F81439)
- Launched USB charging control IC (F75198)
2012
2011
- Launched PCIe interface UR/ISA bridge (F81504)
- Launched RS485 transceiver (F81485)
- Launched three-in-one transceiver (F81438)
2010
- Fintek stock Listed on the Taiwan Emerging Stock Board, Issued IPO on June 29, 2010
- Certified for ISO9001:2008 quality management system
- Launched 128Byte FIFO UART bridge IC (F81216HD)
- Launched uC I/O controller IC (F81866D)
- Launched first fast charging product with transmission function compatible with BC1.2/Apple (F75202)
2010
2009
- Launched small-package LPC I/O controller IC for industrial computers (F71858AD)
- Launched EuP LPC I/O controller IC (F75889F)
2008
- Launched LPC I/O controller IC with hardware KBC function (F71809)
- Launched LPC interface I/O IC with EC function (F71869)
2008
2007
- Relocated to Tai Yuen Hi-Tech Industrial Park
- Launched USB 1.0 to UART bridge (F81232R)
- Launched industrial computer 6*UR LPC interface I/O controller IC (F81865F)
- Launched NB environmental monitoring IC (F75393)
2006
- Launched LPC interface I/O IC with CIR function (F71862)
- Launched LPC interface I/O IC with EC function
2006
2005
- Certified for ISO9001:2000 quality management system
- Implemented ERP system
- Launched I/O controller IC with SPI (F71882F)
2004
- Launched current temperature monitoring IC (F75387S)
- Launched PWM Controller (F72820)
2004
2003
- Launched LPC I/O controller IC (F71801F)
- Launched environmental monitoring IC (F75373S)
- Launched LPC interface ISA bridge (F85226F)
2002
- Feature Integration Technology Inc. (Fintek) founded
- Launched LPC to UART bridge (F81216D)
2002
Hsinchu Headquarters
Taipei Office
Contact Form
Contact Us
If you need further consultation or have any suggestions for our company, please contact us through the following methods.
Call
(+886) 3-5600168